LCM/BL/TPLCD industry automation equipment

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ADR-H500 Automatic AOI solder joint detection and gluing machine
Equipment introduction

将焊锡机焊好的产品经过此设备完成焊锡,焊点焊偏、连锡、多锡、少锡检测后将在另外一个平台根据客户的工艺把高温胶、黑胶贴好。


The products welded by the soldering machine will be pasted with high-temperature glue and black glue on another platform according to the customer's process after the equipment completes the detection of solder, solder joint deviation, tin connection, more tin and less tin.

Performance parameter
项目 规格参数
设备产能/Equipment capacity 约800~1000pcs/h
产品规格/Product specification 0.96~6.98寸
定位方式/Positioning mode CCD对位

贴胶精度/Gluing accuracy

±0.2mm
电源及功率/Power supply and power AC220V  50Hz/60Hz 0.75KW
外形尺寸/Overall dimension L1060*W990*H1560mm
重量/Weight 300kg
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